Lead-Free
Surface Finish and Low-VOC
Conformal Coating (CCAMTF)
Project Number: J-96-EM-008
Joint Test Protocol
The JG-PP /CCAMTF project identified lead as found in tin-lead surface finishes and VOCs, specifically isopropyl alcohol, xylene, toluene, naphtha and lacquer thinner as found in current conformal coatings, as the target HazMats for elimination or reduction.
A joint group consisting of technical electronics representatives from government and industry identified and reached technical consensus on application, performance, and operational impact (supportability) requirements for conformal coatings and surface finishes. The group identified and defined critical tests with descriptions, methodologies, and pass/fail criteria to qualify alternatives against these technical requirements. This JTP contains the critical requirements and tests defined by the technical community to qualify the use of low-VOC conformal coatings or no conformal coatings, and lead-free surface finishes for affected circuit card assemblies. The scope of this JTP is limited to circuit cards that:
- Have electroplated, or rolled, annealed copper circuits on organic laminates
- Are specifically intended for attachment using molten solder either by hand, wave, or reflow soldering
- Contain either surface mount
or pin-in-hole components that will be soldered to the circuit card.
Alternatives being validation tested are:
- Conformal coating options - no conformal coating, parylene, silicone, and urethane
- Surface finishes
- immersion silver plating, immersion gold/palladium plating, and benzimidazole
surface coating.
To view the JTP for Validation of Alternative Surface Finishes and Development of Guidelines for the Usage of Conformal Coatings, Dated March 11, 1998, revised June 23, 1999 please click here.
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Project Matrix
and Points of Contact
Meeting and Teleconference Summaries Joint Test Protocol |