Lead-Free
Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006
Joint Test Protocol
The JG-PP project identified lead as found in tin-lead solder as the target HazMat for elimination or reduction.
In 2002-2003, a joint group consisting of technical electronics representatives from government and industry identified the application, performance, and operational impact (supportability) requirements for lead-free solder. The JTP contains the critical requirements and tests defined by the technical community to qualify the use of lead-free solders for affected circuit card assemblies. The scope of this JTP includes wave and reflow soldering of new circuit cards as well as lead-free rework of tin-lead circuit cards.
The JTP tests identified by the project stakeholders are as follows:
- Vibration
- Mechanical Shock
- Thermal Shock
- Accelerated Thermal Cycling
- Combined Environments Test
- Salt Fog
- Humidity
- Surface Insulation Resistance
- Electrochemical Migration Resistance Test
The test conditions generally reflect the requirements of the IPC J-STD-001B Class 3 end-use product class (high performance electronic products). This performance classification encompasses electronic products where continued high performance or performance-on-demand is critical, end-use environment is harsh, and the equipment must function when required.
To view the DRAFT JTP for Validation of Alternatives to Eutectic Tin-Lead Solders used in Manufacturing and Rework of Printed Wiring Assemblies, dated September 18, 2003, please click here.
To view the Final JTP for Validation of Alternatives to Eutectic Tin-Lead Solders used in Manufacturing and Rework of Printed Wiring Assemblies, dated February 14, 2003 (Revised April 2004), please click here.
The design of the circuit boards to be assembled and tested was another important requirement for the stakeholders to define. The test board agreed upon simulates the electronic components commonly used on legacy military and space electronic systems, as well as some newer components (e.g., array packages). All the lead-free test boards will have an immersion silver board finish, and all the tin-lead assemblies will have a HASL board finish.
To view the Lead-Free Solder test board design, updated August 2003, please click here.
To view the Test Vehicle Modification, July 2004 file, please click here.
| Related Topics |
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Project Matrix and Points of Contact Meeting and Teleconference Summaries Joint Test Protocol |