Lead-Free
Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006
Joint Test Report
A final Draft JTR: JTR Executive Summary (JTR Executive Summary Draft July-30-2007.pdf, 1MB, 74 pages, July 30, 2007) was published. To view the final Draft JTR for Validation of Alternatives to Eutectic Tin-Lead Solders used in Manufacturing and Rework of Printed Wiring Assemblies, please click here.
NOTE: The JTR Executive Summary will remain Draft until the completion of the -20C to + 80C Thermal Cycle test for the "Manufactured" test vehicles. Data contained in the JTR Executive Summary and associated final reports are considered final.
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| Related Topics |
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Project Matrix and Points of Contact Meeting and Teleconference Summaries Joint Test Report |