Lead-Free Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006

JG-PP partnered with the DoD's JCAA on a project to generate critical reliability data on circuit cards manufactured and reworked with lead-free and eutectic tin-lead solders for military and space applications. Government managers with the military and NASA and contractors of space and defense systems face risks from the continued use of tin-lead solder, including: compliance with current environmental regulations, concerns about potential environmental legislation banning lead-containing products, risk of trade barriers and lost sales, reduced mission readiness, and component obsolescence with lead surface finishes. For example, the U.S. EPA has lowered the Toxic Chemical Release reporting threshold for lead to 100 pounds. Overseas, the WEEE directive in Europe and similar mandates in Japan have instilled concern that a legislative body will prohibit the use of lead in electronics soldering. Any potential banning of lead compounds could reduce the DoD's and NASA's supplier base and adversely affect mission readiness. But before considering lead-free electronics for system upgrades or future designs, it is important for the DoD and NASA to know whether lead-free solders can meet their system's requirements. Because no single lead-free solder is likely to qualify for all defense and space applications, it is important to validate alternative solders for discrete applications now.

The JTR Executive Summary was released on April 4, 2006 and an updated version was released on July 20, 2007. The JTR Executive Summary will remain Draft until the completion of the -20C to + 80C Thermal Cycle test for the "Manufactured" test vehicles, the -55C to +125C Thermal Cycle test for the "Hybrid" test vehicles. Data results contained in the JTR Executive Summary are considered final.

The results of the JCAA/JG-PP Lead-Free Solder Project show that the relationship between solder joint reliability, component type and test environment is complex. Some lead-free alloys perform adequately under one test condition, but not for another condition or type of electronic component. However, the results from the project will be used as a tool for OEMs, suppliers and system managers while working the transition to lead-free in high reliability military and aerospace systems. NASA and DoD have initiated a second project that builds on the results of this effort. The focus will be on the rework of tin-lead and lead-free solder alloys and will include the mixing of tin-lead/lead-free and lead-free/tin lead solder alloys. For more details or interest in participating please click here.

This site last updated June 23, 2008.