Projects/Completed


Lead-Free Solder
Project Number: S-01-EM-026

Project Matrix

The matrix below summarizes the project, including the target chemical, alternatives and affected programs.

If you would like to view the Matrix for other projects, click here.

Target Chemical
Current Process
Material Applications

Alternatives
Being Investigated

Affected Programs

Tin-lead

Soldering

Circuit cards

Wave

  • Stabilized Sn/0.7Cu+Ni
  • Sn/3.9Ag/0.6Cu
  • Sn/3.4Ag/1.0Cu/3.3Bi

Reflow/Manual

  • Sn/3.9Ag/0.6Cu
  • Sn/3.4Ag/1.0Cu/3.3Bi

Please click here to view a list of affected DoD and NASA platforms and equipment

Project Points of Contact

All key personnel are listed below. If you would like additional information on this project please contact Warren Assink or Kurt Kessel.

If you would like to view Points of Contact for other projects, click here.

Key Personnel Point of Contact

JCAA, ASC/AAAA
Thomas Andrews, 937-255-7210 x3913
Richard Hricko, Alion, 937-255-7210, x3537

JG-PP Working Group:
Warren Assink, 937-904-0151 (Business & Technical)

Warren Assink, 937-904-0151

Kurt Kessel, ITB,
321-867-8480
kurt.r.kessel@nasa.gov

 

Related Topics

Project Matrix and Points of Contact

Meeting and Teleconference Summaries

Presentations

Technology Survey

Potential Alternatives Report

Joint Test Protocol

Joint Test Report

Information Sheet

Related Links

Project Summary

 

This site last updated February 28, 2008.


Send all questions and comments to jgpp@ctc.com