Lead-Free
Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006
Meeting and Teleconference Summaries
The Meeting and Teleconference Summaries contains basic information about this project and a summary paragraph from each meeting or teleconference held for this project.
Potential Programs/Owners:
Material(s) Targeted for Reduction/Elimination: Lead as found in tin-lead solder.
Phase(s) in Methodology: IV Alternative Demonstration/Validation
Milestones and Prior Decisions:
- May 9, 2001 - The participants at an early customer interface meeting agreed to pursue a lead-free solder JG-PP project.
- November 14-15, 2001 - Project stakeholders met to discuss critical performance requirements for preparing the JTP. It was decided that separate JTPs should be developed for new manufacturing and repair applications. Information on potential alternatives identified to date was also distributed.
- March 7, 2002 - Project stakeholders down-selected three lead-free solders for testing: Sn/0.7Cu (wave only), Sn/3.9Ag/0.6Cu (wave, reflow, and manual), and 92.4Sn/3.4Ag/1.0Cu/3.3Bi (reflow and manual).
- June 17, 2003 - It was determined that the original SnCu solder alloy selected for testing should be upgraded to the improved Sn/0.7Cu+Ni(-0.05Ni) solder alloy, SN100C, from NIHON Superior.
- March 18, 2004 - Assembly of the test vehicles was initiated.
- April 6, 2004 - A modified version of the Mechanical Shock testing procedure was accepted. A prior shock spectrum had been considered, as early as December 2001, but after close examination it was determined that the spectrum was not feasible for our testing because current test vehicle is much too large to be tested under the originally purposed mechanical shock profile. The original profile was established to test actual assembled components and packages, which would be much smaller. Therefore, new profiles were researched, discussed and now appear in the JTP.
- July 19, 2004 - Began to ship assembled test vehicles to the appropriate testing locations.
- Please click here to view the JCAA/JG-PP LFS Project Testing Status as of May 10, 2005
Date of last meeting/teleconference:
April 4, 2006, Cape, Canaveral,
Florida.
Please click here
to view the agenda.
Meeting and Teleconference
Summaries:
On April 4, 2006, a meeting was held. Please click here to view the April 4, 2006 minutes.
On November 17, 2005, a teleconference was held. Please click here to view the November 17, 2005 minutes.
CET JTR Executive Summary as presented during the November 17 telecon.
CALCE Pb-free Solder Interconnect Reliability Modeling Activities
On September 7, 2005, a meeting was held. Please click here to view the September 7, 2005 minutes.
On May 3, 2005 a teleconference was held. Please click here to view the May 3, 2005 minutes.
On March 16, 2005, a meeting was held. Please click here to view the March 16, 2005 minutes.
On December 14, 2004, a meeting was held. Please click here to view the December 14, 2004 minutes.
On September 21, 2004, a meeting was held. Please click here to view the September 21, 2004 meeting minutes.
On August 19, 2004, a teleconference was held. Please click here to view the August 19, 2004 teleconference minutes.
On June 3, 2004, a teleconference was held. Please click here to view the June 3, 2004 teleconference minutes.
On March 18, 2004 a teleconference was held. Please click here to view March 18, 2004 teleconference minutes.
On March 15, 2004 a teleconference was held. Please click here to view March 15, 2004 teleconference minutes.
On March 02, 2004 a teleconference was held. Please click here to view March 02, 2004 teleconference minutes.
On February 24, 2004 a teleconference was held. Please click here to view February 24, 2004 teleconference minutes.
On February 17, 2004 a teleconference was held. Please click here to view February 17, 2004 teleconference minutes.
On February 9, 2004 a teleconference was held. Please click here to view February 9, 2004 teleconference minutes.
On January 23, 2004 a teleconference was held. Please click here to view January 23, 2004 teleconference minutes.
On December 16, 2003 a teleconference was held. Please click here to view December 16, 2003 teleconference minutes.
On November 17, 2003 a teleconference was held. Please click here to view November 17, 2003 teleconference minutes.
On October 16, 2003 a teleconference was held. Please click here to view October 16, 2003 teleconference minutes.
On August 21, 2003, a teleconference was held. Please click here to view the August 21, 2003 teleconference minutes.
On June 1 7, 2003, a teleconference was held. Please click here to view the June 17, 2003 teleconference minutes.
On April 21, 2003, a teleconference was held. Please click here to view the April 21, 2003 teleconference minutes.
On January 23, 2003, a teleconference was held. Please click here to view the January 23, 2003 teleconference minutes.
On December 12, 2002, a teleconference was held. Please click here to view the December 12, 2002 meeting minutes.
On November 12, 2002, a teleconference was held. Please click here to view the November 12, 2002 meeting minutes.
On November 8, 2002, a teleconference was held. Please click here to view the November 8, 2002 teleconference minutes.
On October 1, 2002, a teleconference was held. Please click here to view the October 1, 2002 teleconference minutes.
On August 13-14, 2002, a teleconference was held. Please click here to view the August 13-14, 2002 meeting minutes.
On July 17, 2002,a teleconference was held. Please click here to view the June 6, 2002 teleconference minutes.
On June 6, 2002, a teleconference was held. Please click here to view the June 6, 2002 teleconference minutes.
On April 26, 2002, a teleconference was held. Please click here to view the April 26, 2002 teleconference minutes.
On March 27, 2002, a meeting was held. Please click here to review the full version of the March 27, 2002 meeting minutes.
Additional presentations are available for this meeting, please click on the presentation you wish to view:
-
Initiatives in Lead-Free Soldering: Manufacturing Experience and Industry Feedback, by American Competitiveness Institute
-
Lead Free Solder, Manufacturing Experience and Industry Feedback, by Clive Simmonds, Bae Systems
-
Boeing’s Lead-Free Solder Efforts, by Dr. Richard E. Pinckert Director, Design Integration & Environmental Assurance, Boeing Military Aircraft & Missile Systems Group
-
1st EU - US Lead-Free Solder Interface Meeting, by Danotec (breifing)
-
1st EU - US Lead-Free Solder Interface Meeting, by Danotec (London - opening)
-
US Research Institution Roadmap for the Migration to Lead-free Electronics, by Richard Ciocci, CALCE Electronic Products and Systems Center, University of Maryland
-
1st US-European Union Lead Free Solder Interface Meeting, by Capt. Steve Smolinski, Commanding Officer and Dr. Mike Pestorius, Technical Director, Office of Naval Research, International Field Office
-
JG-PP Lead-Free Solder Project, by Joe Felty Jeff and Bradford, Raytheon Company
-
The Global Environmental Coordination Initiative, by Global Environmental Coordination Initiative
-
ISQ Experience With Lead-Free Solder(ing), by Eduardo Dias Lopes
-
Reducing Environmental Cost and Technical Risks, by Robert Hill, NASA and JG-PP Program Integration ITB, Inc
-
Lead-free in Europe: legislation, technology roadmap and research, by Kay Nimmo, SOLDERTEC at Tin Technology
-
TWI’s Experience of Lead-Free Soldering, Process Issues and the Non-Solder Options, by Norman Stockham, TWI Ltd, Cambridge, UK
On March 19, 2002, a teleconference was held. Please click here to view the March 7, 2002 teleconference minutes.
On March 7, 2002, a teleconference was held. Please click here to view the March 7, 2002 teleconference minutes.
On December 17, 2001, a teleconference was held. Please click here to view the December 17, 2001 teleconference minutes.
On November 14-15, 2001, a meeting was held. Please click here to view the November 14-15, 2001 meeting minutes. Additional presentations are available for this meeting, please click on the presentation you wish to view:
- JG-PP Lead-Free Electronics Solder Project Meeting on November 14-15, 2002 in Dallas, Texas
- Short List of Potential PB-Free Solder Alloys
- Test Vehicle
- Highly Accelerated Life Test (HALT)
- Test Vehicle Modification (August 2004)
On November 1, 2001, a teleconference was held. Please click here to view the November 1, 2001 teleconference minutes.
On September 20, 2001,a teleconference was held. Please click here to view the September 20, 2001 minutes.
On August 8, 2001, a teleconference was held. Please click here to view the the August 8, 2001 minutes.
On June 20, 2001, a teleconference was held. Please click here to view the June 20, 2001 minutes.
On May 9, 2001, a teleconference was held. Please click here to view the May 9, 2001 minutes.
This site last updated February 28, 2008.
| Related Topics |
|
Project Matrix and Points of Contact Meeting and Teleconference Summaries Project Summary |