Lead-Free
Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006
Potential
Alternatives Report
A PAR identifies the baseline process; discusses the potential alternative technologies; identifies initial environmental, safety, and occupational health screening data; and documents the down-selection process. The alternatives selected for testing in accordance with the JTP are documented in this PAR.
The lead-free solder alloys agreed by the project stakeholders to be tested are as follows:
- Stabilized Tin-copper (99.3Sn-0.7Cu+Ni(-0.05Ni)) for wave and manual soldering ·
- Tin-silver-copper (95.5Sn-3.9Ag-0.6Cu) for wave, reflow and manual soldering ·
- Tin-silver-copper-bismuth (92.3Sn-3.4Ag-1.0Cu-3.3Bi) for reflow and manual soldering.
These three alloys were selected based on a combination of their relative likelihood of meeting or exceeding the JTP requirements (based on prior test data), their physical processing characteristics, and their dominance in the solder market.
To view the PAR for for Validation of Alternatives to Eutectic Tin-Lead Solders used in Electronics Manufacturing and Repair, dated August 4, 2003, revised December 2, 2003 please click here.
| Related Topics |
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Project Matrix and Points of Contact Meeting and Teleconference Summaries Potential Alternatives Report |