| Projects/Completed
Lead-Free
Solder
Project Number: S-01-EM-026
Overview of JCAA/JG-PP Lead-Free Solder Project: Overview of JCAA/JG-PP Lead Solder Project, ITB, Inc. (last updated: October 2006) Past Presentations:
April 18, 2005 IPC/JEDEC 8th International Lead Free Conference on Electronic Componenets and Assemblies
March 16, 2005 LFS Meeting Presentations
December 14, 2004 LFS Project Telecon Presentations
September 21, 2004 Lead Free Solder Presentations The following presentations were made at the March 18, 2004 meeting. JCAA/ JG-PP Lead-Free Solder Project Overview, by Kurt Kessel and Brian Greene, ITB, Inc NASA Acquisition Pollution Prevention Office Kennedy Space Center, FL Component & PWB Characterization, and Thermal Cycle Information, by Dave Hillman, Rockwell Collins Inc. Combined Environments Testing JG-PP Lead-Free Solder Project, by Jeff Bradford, Raytheon Commercial Electronics Manufacturing of JG-PP & JC-AA Lead-Free Project Test Vehicles by Lety Campuzano-Contreras, Randy Brown and Kristin Swan, Boeing Solder Joint Reliability Modeling AMRDEC Perspective by David Locher, RDEC JCAA/JG-PP No-Lead Solder Testing by Tom Woodrow, Boeing The following presentations were made at the March 27, 2002 meeting. Initiatives
in Lead-Free Soldering: Manufacturing Experience and Industry Feedback,
by American Competitiveness Institute
Lead
Free Solder, Manufacturing Experience and Industry Feedback, by
Clive Simmonds, Bae Systems
Boeing’s
Lead-Free Solder Efforts, by Dr. Richard E. Pinckert Director, Design
Integration & Environmental Assurance, Boeing Military Aircraft
& Missile Systems Group
1st
EU - US Lead-Free Solder Interface Meeting, by Danotec (breifing)
1st
EU - US Lead-Free Solder Interface Meeting, by Danotec (London
- opening)
US
Research Institution Roadmap for the Migration to Lead-free Electronics,
by Richard Ciocci, CALCE Electronic Products and Systems Center,
University of Maryland
1st
US-European Union Lead Free Solder Interface Meeting, by Capt.
Steve Smolinski, Commanding Officer and Dr. Mike Pestorius, Technical
Director, Office of Naval Research, International Field Office
JG-PP
Lead-Free Solder Project, by Joe Felty Jeff and Bradford, Raytheon
Company
The
Global Environmental Coordination Initiative, by Global Environmental
Coordination Initiative
ISQ
Experience With Lead-Free Solder(ing), by Eduardo Dias Lopes
Reducing
Environmental Cost and Technical Risks, by Robert Hill, NASA and
JG-PP Program Integration ITB, Inc
Lead-free
in Europe: legislation, technology roadmap and research, by Kay
Nimmo, SOLDERTEC at Tin Technology
TWI’s
Experience of Lead-Free Soldering, Process Issues and the Non-Solder
Options, by Norman Stockham, TWI Ltd, Cambridge, UK
The following
presentations were made at the November 14-15, 2001 meeting.
The following presentations were made at the June 20, 2001 meeting. Lead-Free Electronics Soldering Presentation TI Commercial View of Pb-Free Cmponents/Futures The following presentations were made at the May 9, 2001 meeting. Overview of No-Lead Solder Opportunity, Mike Leake, Raytheon ACI Initiative in Lead Free Solder, Lee Whiteman, ACI Lead-Free Joint Fatigue, Richard Salzbrenner, Sandia Labs Boeing Lead-Free Solder Efforts, Thomas Woodrow, Boeing NCMS Experience with Lead-Free Solder, Duane Napp, NCMS NCMS Experience with Lead-Free Solder (continued), Lee Patch, NCMS Overview of Joint Group on Pollution Prevention, Robert Hill, JG-PP Working Group Chairman Overview of Single Process Initiative, David James, DCMA |
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This site last updated February 28, 2008. Send all questions and comments to jgpp@ctc.com |