Projects/Completed

Lead-Free Solder
Testing for High Reliability

Project Number: S-01-EM-026
Completed in 2006


Presentations

Overview of JCAA/JG-PP Lead-Free Solder Project:

Overview of JCAA/JG-PP Lead Solder Project, ITB, Inc. (last updated: October 2006)

Past Presentations:

PATHWAY TO IMPLEMENTING LEAD-FREE SOLDER ALLOYS – Comparison table of NASA-USAF Aging Aircraft solder project vs. possible future work

Test Vehicle Modification

April 18, 2005 IPC/JEDEC 8th International Lead Free Conference on Electronic Componenets and Assemblies

March 16, 2005 LFS Meeting Presentations

December 14, 2004 LFS Project Telecon Presentations

September 21, 2004 Lead Free Solder Presentations

The following presentations were made at the March 18, 2004 meeting.

JCAA/ JG-PP Lead-Free Solder Project Overview, by Kurt Kessel and Brian Greene, ITB, Inc NASA Acquisition Pollution Prevention Office Kennedy Space Center, FL

Component & PWB Characterization, and Thermal Cycle Information, by Dave Hillman, Rockwell Collins Inc.

Combined Environments Testing JG-PP Lead-Free Solder Project, by Jeff Bradford, Raytheon

Commercial Electronics Manufacturing of JG-PP & JC-AA Lead-Free Project Test Vehicles by Lety Campuzano-Contreras, Randy Brown and Kristin Swan, Boeing

Solder Analysis Report

Solder Joint Reliability Modeling AMRDEC Perspective by David Locher, RDEC

Electrochemical Migration Surface Insulation Resistance Boeing Anaheim Test Equipment Joint Group on Pollution Prevention Meeting by John Kerr

JCAA/JG-PP No-Lead Solder Testing by Tom Woodrow, Boeing

JCAA/ JG-PP Lead-Free Solder Project 1st General Meeting US/GE Environmental Technology DEA Berlin, Germany 16-20 February, 2004

The following presentations were made at the March 27, 2002 meeting.

1st EU - US Lead-Free Solder Interface Meeting, by Danotec (London - opening)
US Research Institution Roadmap for the Migration to Lead-free Electronics, by Richard Ciocci, CALCE Electronic Products and Systems Center, University of Maryland
1st US-European Union Lead Free Solder Interface Meeting, by Capt. Steve Smolinski, Commanding Officer and Dr. Mike Pestorius, Technical Director, Office of Naval Research, International Field Office
JG-PP Lead-Free Solder Project, by Joe Felty Jeff and Bradford, Raytheon Company
The Global Environmental Coordination Initiative, by Global Environmental Coordination Initiative
Reducing Environmental Cost and Technical Risks, by Robert Hill, NASA and JG-PP Program Integration ITB, Inc
Lead-free in Europe: legislation, technology roadmap and research, by Kay Nimmo, SOLDERTEC at Tin Technology
The following presentations were made at the November 14-15, 2001 meeting.

The following presentations were made at the June 20, 2001 meeting.

Lead-Free Electronics Soldering Presentation

TI Commercial View of Pb-Free Cmponents/Futures

The following presentations were made at the May 9, 2001 meeting.

Overview of No-Lead Solder Opportunity, Mike Leake, Raytheon

ACI Initiative in Lead Free Solder, Lee Whiteman, ACI

Lead-Free Joint Fatigue, Richard Salzbrenner, Sandia Labs

Boeing Lead-Free Solder Efforts, Thomas Woodrow, Boeing

NCMS Experience with Lead-Free Solder, Duane Napp, NCMS

NCMS Experience with Lead-Free Solder (continued), Lee Patch, NCMS

Overview of Joint Group on Pollution Prevention, Robert Hill, JG-PP Working Group Chairman

Overview of Single Process Initiative, David James, DCMA

Related Topics

Project Matrix and Points of Contact

Meeting and Teleconference Summaries

Presentations

Technology Survey

Potential Alternatives Report

Joint Test Protocol

Joint Test Report

Information Sheet

Related Links

Project Summary

 

This site last updated February 28, 2008.


Send all questions and comments to jgpp@ctc.com