Lead-Free Solder
Testing for High Reliability
Project Number: S-01-EM-026
Completed in 2006

Related Links

The links below contain additional information about lead-free solder. Please use the internal search engines on the websites to acquire the information.

European Association of Aerospace Industries

High Density Packaging User Group International

IKP, Department of Life Cycle Engineering Presentation

IPC

National Center for Manufacturing Sciences

National Institute of Standards and Technology

OEM Roadmaps

Risks of Conductive Whiskers in High-Reliability Electronics and Associated Hardware from Pure Tin Coatings

Texas Instrument's Lead-Free Solder Website - The information on this Web site pertains to the briefing that Mr. Doug Romm, TI, presented at the 20 June 2001 project meeting in Dallas.

Tin Whisker Experiences

This site last updated February 28, 2008.